Ta'avale Electronics PCBA laupapa
Fa'ailoga oloa
● -Su'ega fa'atuatuaina
● -Su'esu'e
● - Pulea vevela
● -Kopa mamafa ≥ 105um
● -HDI
● -Semi - fetuutuunai
● -Maa'a'a - fe'i
● -Milemita maualuga faʻavevela microwave
uiga fausaga PCB
1. Dielectric layer (Dielectric): E faʻaaogaina e faʻamautu ai le faʻaogaina i le va o laina ma laulau, e masani ona taʻua o le substrate.
2. Silkscreen (Legend/Marking/Silkscreen): O se vaega e le taua.O lana galuega autu o le faailogaina o le igoa ma le tulaga pusa o vaega taitasi i luga o le laupapa matagaluega, lea e faigofie mo le tausiga ma le faailoaina pe a uma le faapotopotoga.
3.Surface togafitiga (SurtaceFinish): Talu ai e faigofie ona oxidized le apamemea luga i le siosiomaga lautele, e le mafai ona tinned (le lelei solderability), o lea o le a puipuia le apamemea luga e tinned.O auala puipuia e aofia ai HASL, ENIG, Immersion Silver, Immersion TIn, ma organic solder preservative (OSP).O metotia taʻitasi e iai ona lava lelei ma faʻaletonu, faʻatasi e taʻua o togafitiga luga.
PCB Fa'ainisinia Avanoa
| Laupapa | Gaosiga tele: 2~58 laulau / Pilot run: 64 layers |
| Max.mafiafia | Gaosiga tele: 394mil (10mm) / Pilot Run: 17.5mm |
| Meafaitino | FR-4 (Standard FR4, Mid-Tg FR4, Hi-Tg FR4, Lead free assembly material) , Halogen-Free, Ceramic tumu, Teflon, Polyimide, BT, PPO, PPE, Hybrid, Partial hybrid, etc. |
| Min.Lautele/Sopa | I totonu: 3mil/3mil (HOZ), fafo: 4mil/4mil(1OZ) |
| Max.Kopa Mafiafia | UL fa'amaonia: 6.0 OZ / Pilot run: 12OZ |
| Min.Tele Pu | vili fa'ainisinia: 8mil(0.2mm) vili leisa: 3mil(0.075mm) |
| Max.Tele Panel | 1150mm × 560mm |
| Ituaiga Fa'atatau | 18:1 |
| Fa'ai'uga | HASL, Fa'atofu Auro, Fa'atofuina Apa, OSP, ENIG + OSP, Fa'atofu Silver, ENEPIG, Tama'ilima Auro |
| Fa'agasologa Fa'apitoa | Puta Tanu, Pu Tauaso, Fa'amauina Tete'e, Fa'apipi'i Gafatia, Fa'ato'aga, Fa'atosina vaega, Fa'atosina maualuga vaega, Toe viliina, ma le fa'atonutonuina o le Tete'e. |
